Requirement of multiple Lap and Polish Tools
Public summary
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The National Research Council of Canada (NRC) appears to be seeking several pieces of specialized lapping, polishing, bonding, measurement, and cleaning equipment for the Canadian Photonics Fabrication Centre (CPFC) in Ottawa, Ontario. The equipment would support the CPFC’s move to 4-inch wafer processing and help improve surface flatness, thickness consistency, optical performance, production stability, and throughput. The listed requirement is: - Three modular wafer bonding systems - One LP70 multi-station lapping and polishing system - One PP6GT precision polishing jig with vacuum adaptor - One CG10 contact measurement gauge - One solvent vapour cleaner The tender is shown as open and has a closing date of November 16, 2026, at 2:00 p.m. The notice lists Canada and several international regions, with Ottawa, Ontario identified as the specific location. This may be relevant to manufacturers, authorized distributors, or specialized equipment suppliers able to provide the specified systems and any required delivery, installation, training, warranty, or support services.The available tender document is: https://canadabuys.canada.ca/sites/default/files/webform/tender_notice/111702/acan-26-58197_en-logitech.pdf Before deciding whether to bid, review the official tender notice and all attachments carefully. Confirm the exact technical specifications, mandatory requirements, delivery and installation terms, submission process, security or certification requirements, and whether equivalent products are permitted. The official notice should be treated as controlling, and the details should be verified before submitting a bid.
Requirement preview
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- The tender is issued by the National Research Council of Canada (NRC) for the Canadian Photonics Fabrication Centre (CPFC).
- The requirement appears to cover equipment supporting modernization to 4-inch wafer processing capability.
- The procurement identifies a requirement for three (3) Modular Wafer Bonding Systems.
- The procurement identifies a requirement for one (1) LP70 multi-station lapping and polishing system.
Source description preview
Imported source text may contain formatting from the original notice.
The National Research Council Canada (NRC) has a requirement for multiple lapping and polishing tools to support the CPFC’s modernization to 4” wafer processing capability. Lapping and polishing equipment are mission critical for a photonics foundry producing waveguides, modulators, lasers, filters, or integrated photonic circuits. These tools ensure substrate flatness, surface quality, and thickness uniformity, all of which directly affect optical performance, coupling efficiency, and device yield. The CPFC has a requirement to update its aging lapping and polishing tools degrade as they currently contribute to manufacturing risks to yield, optical performance, process stability, and throughput. Replacing aging tools is essential to maintain foundry grade capability, support customer programs, and prevent production interruptions as the CPFC progresses to 4” wafer processing capability.The CPFC requires the procurement of: o Three (3) Modular Wafer Bonding System o One (1) LP70 multi-station lapping and polishing system o One (1) PP6GT Precision Polishing Jig with Vacuum adaptor o One (1) CG10 Contact Measurement Gauge o One (1) Solvent Vapour Cleaner NRC is investing in semiconductor fabrication infrastructure and related research capabilities to strengthen Canada’s compound semiconductor innovation and commercialization pipeline. As part of this initiative, the Canadian Photonics Fabrication Centre (CPFC) is transitioning to a 4” wafer processing photonics foundry which includes the modernization of its aging lapping and polishing equipment. These upgrades will enable CPFC to deliver photonic devices with tightly controlled variability in critical parameters (roughness, thickness, flatness, etc) and tightened tolerance specifications (facet polishing, high-flatness bonding surfaces) while decreasing maintenance costs and downtime.
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