Requirement of multiple Lap and Polish Tools
Public summary
Generated or condensed from imported source text. Verify before bidding.
## Tender summary The National Research Council of Canada (NRC) appears to be seeking suppliers for specialized lapping, polishing, bonding, measurement, and cleaning equipment for the Canadian Photonics Fabrication Centre (CPFC) in Ottawa, Ontario. The equipment is intended to support CPFC’s transition to 4-inch wafer processing and help improve surface flatness, polishing quality, thickness uniformity, production stability, and photonic device yield. ### Equipment requested - Three modular wafer bonding systems - One LP70 multi-station lapping and polishing system - One PP6GT precision polishing jig with vacuum adaptor - One CG10 contact measurement gauge - One solvent vapour cleaner ### Key details - **Buyer:** National Research Council of Canada - **Location:** Ottawa, Ontario; the notice lists broad international locations as well - **Status:** Open - **Closing date:** November 16, 2026, at 2:00 p.m. - **Category:** Goods This opportunity potentially matches manufacturers, authorized distributors, and specialized equipment suppliers serving semiconductor, photonics, wafer-processing, or precision surface-finishing applications. The named equipment models may indicate specific technical requirements or compatibility expectations. The supplied tender notice should be reviewed carefully for specifications, delivery requirements, mandatory certifications, submission instructions, evaluation criteria, and any restrictions on equivalent products. A business should not assume it qualifies based on this summary alone. Verify the complete official notice and all amendments before submitting a bid.The provided document is available here: https://canadabuys.canada.ca/sites/default/files/webform/tender_notice/111702/acan-26-58197_en-logitech.pdf
Requirement preview
A profile unlocks the full bid checklist and match explanation.
- The National Research Council of Canada (NRC) requires multiple lapping and polishing tools for the Canadian Photonics Fabrication Centre (CPFC).
- The procurement includes three (3) Modular Wafer Bonding Systems.
- The procurement includes one (1) LP70 multi-station lapping and polishing system.
- The procurement includes one (1) PP6GT Precision Polishing Jig with Vacuum adaptor.
Source description preview
Imported source text may contain formatting from the original notice.
The National Research Council Canada (NRC) has a requirement for multiple lapping and polishing tools to support the CPFC’s modernization to 4” wafer processing capability. Lapping and polishing equipment are mission critical for a photonics foundry producing waveguides, modulators, lasers, filters, or integrated photonic circuits. These tools ensure substrate flatness, surface quality, and thickness uniformity, all of which directly affect optical performance, coupling efficiency, and device yield. The CPFC has a requirement to update its aging lapping and polishing tools degrade as they currently contribute to manufacturing risks to yield, optical performance, process stability, and throughput. Replacing aging tools is essential to maintain foundry grade capability, support customer programs, and prevent production interruptions as the CPFC progresses to 4” wafer processing capability.The CPFC requires the procurement of: o Three (3) Modular Wafer Bonding System o One (1) LP70 multi-station lapping and polishing system o One (1) PP6GT Precision Polishing Jig with Vacuum adaptor o One (1) CG10 Contact Measurement Gauge o One (1) Solvent Vapour Cleaner NRC is investing in semiconductor fabrication infrastructure and related research capabilities to strengthen Canada’s compound semiconductor innovation and commercialization pipeline. As part of this initiative, the Canadian Photonics Fabrication Centre (CPFC) is transitioning to a 4” wafer processing photonics foundry which includes the modernization of its aging lapping and polishing equipment. These upgrades will enable CPFC to deliver photonic devices with tightly controlled variability in critical parameters (roughness, thickness, flatness, etc) and tightened tolerance specifications (facet polishing, high-flatness bonding surfaces) while decreasing maintenance costs and downtime.
Turn this listing into a bid decision.
Build a company profile to unlock match scoring, explanations, checklist next steps, saved opportunity tracking, and alerts.